I thought about designing a computer overclocking product, it is basically watercooled heatpipes with copper fins to increase surface area. I’m sure most of you guys have no clue what I’m saying. Thing I’m trying to get to is, the patent can be very, very costly and unless you have quite a bit to spare or total confidence in it, it could get troublesome.
Ahhh, this already exists Zalman and many other companies have been making these for years. As a matter of fact, ThermalTake created a passive laptop cooling stand using these heatpipes mounted on an aluminum sheet with fins underneath.
Yea I understand heatpipes are used with copper/aluminin fins, but my idea was to submerge that whole structure under water, which back then (about four years ago), wasn’t out. I’m not too up to date with these kind of things. You seem like a computer geek
Heres the link to my idea: http://www.xtremesystems.org/Forums/showthread.php?t=81128
I’ve seen someone take all the panels of a computer tower and submerge the tower frame in an aquarium filled with mineral spirits. Then run water cooling pipes into the tank and circulate and cool the mineral spirits. It was cool and worked well, you can find videos on youtube.